ullc0408fc05c* unbumped low capacitance flip chip array 1 05221.r1 5/07 *u.s. patent no. 6,867,436 www.protekdevices.com applications ? cellular phones ? personal digital assistant (pda) ? notebook computers ? smart cards iec compatibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns features ? esd protection > 25 kilovolts ? low esd overshoot voltage ? bidirectional configuration & monolithic structure ? protects 4 isolated lines ? low capacitance: 6pf ? low leakage current ? rohs compliant mechanical characteristics ? standard eia chip size: 0408 ? weight 0.73 milligrams (approximate) ? solder reflow temperature: lead-free: 260-270c ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? device marking on reel 05221 pin configuration
2 05221.r1 5/07 www.protekdevices.com ullc0408fc05c* device characteristics storage temperature symbol v alue c -55c to 150c units t stg parameter operating temperature t a -55c to 150c c maximum ratings @ 25c unless otherwise specified note 1: device is bidirectional. part number (see notes 1) minimum breakdown voltage @ 1ma v (br) volts typical capacitance 0v @ 1 mhz c pf ullc0408fc05c 6.0 6 maximum leakage current @v wm i d a 5.0 rated stand-off voltage v wm volts 5.0 electrical characteristics per line @ 25c unless otherwise specified
3 05221.r1 5/07 www.protekdevices.com ullc0408fc05c* esd test pulse - 25 kilovolt, 1/30ns (waveshape) figure 1 overshoot & clamping voltage 5 volts per division -5 5 15 25 35 v r - reverse voltage - volts c j - capacitance - pf figure 2 capacitance vs reverse voltage graphs
4 05221.r1 5/07 www.protekdevices.com ullc0408fc05c* ramp-up ramp-down ramp-up 15 seconds solder time 15-20 seconds ramp-down t s - preheat t smax t smin t l t 25c to peak 30-60 seconds temperature - c t p 155 140 0.275mm round non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening (laser cut, 5% tapered walls) solder paste type pad protective finish tolerance - edge to corner ball solder ball side coplanarity maximum dwell time above liquidous (183c) soldering maximum temperature printed circuit board recommendations parameter value requirements temperature: t p for lead-free (snagcu): 260-270c t p for tin-lead: 240-245c preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. recommended non-solder mask defined pad illustration non-solder mask defined pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia. application information
5 05221.r1 5/07 www.protekdevices.com ullc0408fc05c* u0408 package outline & dimensions a b c e f i 0.56 nom 0.86 nom 0.99 0.0254 0.15 sq 2.0 0.0254 0.406 nom 0.022 nom 0.034 nom 0.039 0.001 0.006 sq 0.079 0.001 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). package outline mounting pad layout - option 1 a c d e f g h i 0.51 0.30 0.46 0.20 0.15 sq 0.71 0.99 0.51 note: 1. preferred: using 0.1mm (0.004?) stencil. 0.020 0.012 0.018 0.008 0.006 sq 0.028 0.039 0.020 pad dimensions dim millimeters inches outline & dimensions: rev 3 - 2/04, 06026 c solder print 0.010? - 0.012? dia. a h d i solder pads f g e solder mask die solder contact metalized die contact e f i side a b c top end
6 05221.r1 5/07 www.protekdevices.com ullc0408fc05c* copyright ? prot ek devices 2007 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility with respect to the selec tion or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com a f g h i 0.51 0.15 sq 0.71 0.99 0.51 0.020 0.006 sq 0.028 0.039 0.020 dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). 3. preferred: using 0.1mm (0.004?) stencil. mounting pad layout - option 2 tape & reel ordering nomencla- ture 1. surface mount product is taped and reeled in accordance with eia 481. 2. 8mm plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-1 (i.e., ullc0408fc05c-t75-1). 3. 8mm paper tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-2 (i.e., ullc0408fc05c-t75-2). outline & dimensions: rev 3 - 2/04, 06026 tape & reel orientation note: 1. top view of tape. solder bumps are face down in tape package. quad die - 0408 copper contact 0.009? [0.23] dia. solder print 0.014? [0.36] dia. a h i f g solder mask die solder contact u0408 package outline & dimensions
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